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PTN3331
High speed differential line driver
Rev. 01 -- 06 August 2002 Product data
1. Description
The PTN3331 is a differential line driver that implements the electrical characteristics of Low-Voltage Differential Signaling (LVDS) that meets or exceeds the requirements of the ANSI TIA/EIA-644 Standard. LVDS is used to achieve higher data rates on commonly used media. LVDS overcomes the limitations of achievable slew rates and EMI restrictions of previous differential signaling techniques. The PTN3331 operates at 3.3 volt supply levels and current mode output drivers. The output drivers will deliver a minimum of 247 mV into a 100 load when enabled. The intended application of this device is for point-to-point baseband transmission rates over a controlled impedance media of approximately 100 . The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media selected and the noise coupling to the environment. The PTN3331 is designed to function over the full industrial temperature range of -40 C to +85 C.
2. Features
s Meets or exceeds the requirements of ANSI TIA/EIA-644 Standard s Low-Voltage Differential Signaling with output voltage of 350 mV across a 100 load s 300 ps maximum channel to channel output skew s 500 ps typical output voltage rise and fall times s Power dissipation of 100 mW typical at 200 MHz s Driver at high impedance when disabled or with VCC = 0 V s 5 volt tolerant inputs with Low Voltage TTL (LVTTL) logic input levels s Pin-compatible with AM26LS31 and SN65LVDS31.
3. Applications
s Low voltage, low EMI, high speed differential signaling s Point-to-point high speed data transmission s High performance switches and routers.
Philips Semiconductors
PTN3331
High speed differential line driver
4. Ordering information
Table 1: Ordering information Package Name PTN3331DH PTN3331D TSSOP16 SO16 Description plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic small outline package; 16 leads; body width 3.9 mm Version SOT403-1 SOT109-1 Type number
5. Functional diagram
PTN3331
G G 1A 4 12 2 1 LVDS 3 1Y 1Z
6 2A 7 LVDS 5
2Y 2Z
10 3A 9 LVDS 11
3Y 3Z
14 4A 15 LVDS 13
4Y 4Z
002aaa017
Fig 1. Functional diagram.
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
2 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
6. Pinning information
6.1 Pinning
1A 1Y 1Z G 2Z 2Y 2A GND
1 2 3
16 VCC 15 4A 14 4Y
1A 1Y 1Z G 2Z 2Y 2A GND
1 2 3
16 VCC 15 4A 14 4Y
PTN3331DH
PTN3331D
4 5 6 7 8
13 4Z 12 G 11 3Z 10 3Y 9 3A
4 5 6 7 8
13 4Z 12 G 11 3Z 10 3Y 9 3A
002aaa025
002aaa018
Fig 2. TSSOP16 pin configuration.
Fig 3. SO16 pin configuration.
6.2 Pin description
Table 2: Symbol 1A 1Y 1Z G 2Z 2Y 2A GND 3A 3Y 3Z G 4Z 4Y 4A VCC Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Description LVTTL input LVDS non-inverting output LVDS inverting output Enable (active-HIGH) LVDS inverting output LVDS non-inverting output LVTTL input Ground LVTTL input LVDS non-inverting output LVDS inverting output Enable (active-LOW) LVDS inverting output LVDS non-inverting output LVTTL input Supply
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
3 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
7. Functional description
7.1 Function table
Table 3: Function table H = HIGH level; L = LOW level; X = irrelevant; Z = high impedance. Input A H L H L X Open Open Enables G H H X X L H X G X X L L H X L Outputs Y H L H L Z L L Z L H L H Z H H
8. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI Tamb Tj Tstg Parameter supply voltage input voltage short circuit duration operating ambient temperature range operating junction temperature storage temperature range ESD
[1]
Min -0.5 -0.5 -40 -40 -65 >2
Max 4.0 VCC + 0.5 +85 +150 +150 -
Unit V V sec C C C kV
Continuous
Values beyond absolute maximum ratings can cause the device to be prematurely damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied.
9. Recommended operating conditions
Table 5: Symbol VCC VIH VIL Recommended operating conditions Parameter supply voltage HIGH-level input voltage LOW-level input voltage Min 3 2 Nom 3.3 Max 3.6 0.8 Unit V V V
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
4 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
10. Static characteristics
Table 6: DC electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol VOD VOD VOC(SS) VOC(SS) Parameter differential output voltage change in differential voltage magnitude between logic states Steady-state common-mode output voltage Change in steady-state common-mode output voltage between logic states Peak-to-peak common-mode output voltage Supply current VI = 0.8 or 2 V; enabled, no load VI = 0.8 or 2 V; enabled, RL = 100 VI = 0 V or VCC; disabled IIH IIL IOS IOZ IO(OFF) Ci
[1]
Conditions RL = 100 See Figure 4.
Min 247 -50 1.125 -50
Typ[1] 340 1.2 -
Max 454 +50 1.375 +50
Unit mV mV V mV
VOC(PP) ICC
1 -
50 22 25 0.25 4 0.1 -4 1 3
150 30 35 1 20 10 -24 -1 -
mV mA mA mA A A mA A A pF
HIGH-level input current LOW-level input current Output short circuit current High-impedance output current Power-off output current Input capacitance
VIH = 2 V VIL = 0.8 V VO(Y) or VO(Z) = 0 V VOD = 0 V or 2.4 V VCC = 0 V; VO = 2.4 V
All typical values are at Tamb = 25 C and VCC = 3.3 V.
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
5 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
11. Dynamic characteristics
Table 7: AC electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol tPLH tPHL tr tf tsk(p) tsk(o) tsk(p-p) tPZH tPZL tPHZ tPLZ Parameter Propagation delay, LOW-to-HIGH level output Propagation delay, HIGH-to-LOW level output Differential output rise time (20 to 80%) Differential output fall time (80 to 20%) Pulse skew (tPHL - tPLH) Channel-to-channel output skew Part-to-part skew Propagation delay, high-impedance to HIGH-level output Propagation delay, high-impedance to LOW-level output Propagation delay, HIGH-level to high-impedance output Propagation delay, LOW-level to high-impedance output See Figure 6.
[2], [4] [3], [4]
Conditions RL = 100 ; CL = 10 pF See Figure 5.
[4] [4]
Min 0.5 1 0.4 0.4 -
Typ[1] 1.4 1.7 0.5 0.5 0.3 0 5.4 2.5 8.1 7.3
Max 2 2.5 0.6 0.6 0.6 0.3 800 15 15 15 15
Unit ns ns ns ns ns ns ps ns ns ns ns
[1] [2] [3] [4]
All typical values are at Tamb = 25 C, and VCC = 3.3 V. tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. tsk(p-p) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, same temperature, and have identical packages and test circuits. Guaranteed by design and characterization.
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
6 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
12. Test figures
Y A LVDS Z R 100 1% CL 10 pF CL 10 pF VOD
A
VOC
VOC(PP) VOC(SS)
Y A LVDS Z CL 10 pF R = 49.9 1% (2 PLACES) CL 10 pF VOC
002aaa019
Fig 4. Test circuit and voltage definitions.
2V A INPUT 1.4 V 0.8 V tPHL tPLH 100% 80%
VOD
20% 0%
tf
tr
002aaa020
Fig 5. Propagation delay definitions.
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
7 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
2V G 1.4 V 0.8 V 2V G 1.4 V 0.8 V tPHZ tPZH 100%, 1.4 V 50% 0%, 1.2 V tPZL tPLZ 100%, 1.2 V 50% 0%, 1 V
002aaa021
Fig 6. Enable and disable time definitions.
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
8 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
13. Package outline
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27
Fig 7. TSSOP16 package outline (SOT403-1).
9397 750 08339 (c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
9 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 pin 1 index Lp 1 e bp 8 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.050 0.041 0.228
0.028 0.004 0.012
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
Fig 8. SO16 package outline (SOT109-1).
9397 750 08339 (c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
10 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C small/thin packages.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
9397 750 08339
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
11 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
14.5 Package related soldering information
Table 8: Package[1] BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[4], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[3] suitable not recommended[4][5] not recommended[6] Reflow[2] suitable suitable suitable suitable suitable
[3]
[4] [5] [6]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
15. Revision history
Table 9: Rev Date 01 20020806 Revision history CPCN Description Product data. Initial version. Engineering Change Notice 853-2362 28701 dated 2002 August 06.
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 08339
Product data
Rev. 01 -- 06 August 2002
12 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
16. Data sheet status
Data sheet status[1] Objective data Preliminary data Product status[2] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Product data
Production
[1] [2]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
9397 750 08339
Fax: +31 40 27 24825
(c) Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 -- 06 August 2002
13 of 14
Philips Semiconductors
PTN3331
High speed differential line driver
Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Test figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 12 Package related soldering information . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
(c) Koninklijke Philips Electronics N.V. 2002. Printed in the U.S.A
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 06 August 2002 Document order number: 9397 750 08339

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